HistoryUltrasonic technology can be found from the research conducted by Pierre Curie on the piezoelectric effect in 1880. Pierre Curie discovered that asymmetric crystals like Rochelle salt and quartz can generate an electrical charge once mechanical pressure is applied. Mechanical vibrations are thus obtained by applying electrical oscillations to the crystals. The frequency of ultrasonic waves should be greater than 20,000 Hz. (Sound waves). After all the research on ultrasonic technology, the first ULTRA SONIC MACHINING (USM) was built in the 1950s. The United States develops ultrasonic machining and has been used for machining materials that require a sturdy machine. TypesThere are two types of Ultrasonic Machining:-• Ultrasonic Machine (USM)• Rotary Ultrasonic Machine (RUM)Component and EquipmentUltrasonic has 5 different main components and equipmentAnd all this system depends on others:-A- Power supplyB -TransducerC-Tool HolderD-ToolsE-AbrasiveUSM SystemUltrasonic machining system mainly uses concentrator, magnetostrictor, slurry and tool. the magnetostrictor creates small amplitude vibrations and revitalized at the ultrasound frequency Abrasive slurry - Most types of abrasives • (SiC) silicon carbide germanium, ceramic glass • diamond (for rubies) • (Al2O3) corundum • ( B4C) boron carbide is good in general, but also expensive • boron silicacarbon (more abrasive than B4C) - Liquid • Oils • Glycerol • Benzene • Water (most used) - 100 to 800 is the grain size typical- High viscosity decreases the MRR (Material Removal Rate)Tool HolderThe tool holder also connects and holds the tool to the transducer. It practically transmits energy and, in certain situations, amplifies the amplitude of vibrations. M...... middle of paper......60 HRC such as tungsten glass, carbides and ceramics (Rockwell hardness (HRB or HRC) is the measure of hardness of materials)Advantages1- Drilling non-circular and circular holes even in hard materials2- Its non-thermal nature therefore less stress3- Does not produce chemical, electrical or thermal effect on the surface4- Precise machining of hard and brittle materials5- Less disfigurement and less process of burr6- It can be applied in semiconductor materials7- High quality finishing surface8- Can machine all materials regardless of their conductivity.Disadvantages1- Low MRR (Material Removal Rate)2- The tool can wear out quickly3- Difficult to drill deep holes.4- Difficult to get into sharp corners.5- It is not flat at the bottom of the cavity.7- Power consumption is high.8- Cannot be used only when the working hardness is 45 HRC or more.